TSMC is advancing the construction of its CoPoS supply chain, aiming for mass production next year.

According to a report by South Korean news outlet ETNews, TSMC is building its CoPoS materials, components, and equipment supply chain, aiming for mass production next year, according to Citrini analyst Jukan on the X platform. PLP (PoS Packaging Processing) is a technology that packages pre-cut chips onto rectangular panels, reducing waste in edge areas compared to circular wafer-level packaging (WLP). Based on a standard 600×600 mm rectangular panel, chip output is approximately 5 to 6 times that of a mainstream 300 mm 12-inch wafer.